The frequency of discussion about chips that have not yet entered QS is completely rumor.
The frequency of discussion about chips that have not yet entered QS is completely rumor.
When a 300mm chip was only worth $5,000, the chip factory was just a laborer. Now the price of 300mm chips is already $30,000, and the next generation is moving towards $50,000. Fabless will be the labor force in the next 10 years.
When a 300mm chip was only worth $5,000, the chip factory was...
I think foveros(36UM@MTL & ARL) makes the higher latency(70ns to ARL-S),the speed for D2D(3.2GHZ @arl-S) is too slow ,and avoid more heat.
Nova lake put the imc @ soc tile too!!! Intel should find the better connection for chip2chip,maybe hybrid bonding ?
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